Automated Tray IC Lead /

Mark Inspection System



HL-760S system performs efficient and precise lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. The lead scanning mechanism performs multi-unit pick & place lead / ball scanning while the mark scanning and sorting mechanism performs column-by-column mark / surface scanning as well as sorting and binning of pass and fail units.

This multi-task design makes system throughput up to around 12K UPH for operation depending on IC package size. Besides, system designed with small size, low height and storage space on the top can optimize spatial allocation for operation.

Vision Inspection Systems

Laser Marker System

Service Change

Dear Customers

To best-support our customers, we have moved our software download service on this web to a place where registered customer can only reach.  From now on, customers need to register first in order to download up-to-date software for our products.

Please visit our "Home" page and register.  We are sorry for any inconvenience that may cause.  If you need any further assistance, please contact us for further help at Thank you!!

Download HL-760S

Pan Asia Programming Service with ISO-14001, ISO-9001
, and Automotive TS16949 certified.

3D Lead scan, Coplanarity, 2D measurement,
PVI defect, Scratches, Cracks etc. and Laser marking.

High density NAND,eMMC etc., Customized programming

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