Auto Programming System 

 

  • Up to 2000 UPH with 4 pick & place nozzles1
  • Equipped with 4 units of ALL-200G or ALL-300G programmers, supports up to 64 sockets
  • Flexible I/O options. Supports tray / tape / tube
  • Accuracy – oriented design and precise vision positioning system capable of handling 1.5mm x 1.5mm devices such as WLCSP
ALL 300GeMMC s2 copy 

High throughput, high performance

ALL 300GeMMC s2 copy 
  • Equipped with 4 nozzles, up to 2000 UPH
  • Well balanced hardware design with optimized system parameters ensure the handling accuracy under high speed movement

New generation device programmer

  • Equipped with 4 units of ALL-200G or ALL-300G programmers
  • Up to 64 devices programming simultaneously
  • Support wide range of devices including MCU/MPU, EEPROM, eMMC, eMCP, SPI memory, NOR/NAND flash, FPGA, etc…

Precise vision positioning system

  • Carried camera (0.3M pixels) for socket positioning
  • Fixed camera (1.3M pixels) for IC pick & place positioning
  • Minimize the jam rate during handling as well as the possibility of lead bent. Capable of handling as small as 1.5mm x 1.5mm devices such as WLCSP
  • New generation image processing core realizes fully auto vision positioning process

Smart operating software

  • All setup data such as IC type, socket type and position, are saved accordingly to achieve zero changeover time
  • User friendly operating interface minimize the possibility of misoperation
  • Provides detailed information of machine status, production status, warning, etc…
  • Detailed production reports and log files are saved for traceability

Support package conversion between tray / tube / tape

Other optional equippments

Laser marker Label feeder Pad printing system

Specifications

Throughput Max. 2000 UPH
Pick & Place System Transmission Precision ball screws and linear guides
Drive system Servo motors
Resolution X/Y/Z:0.0025 mm;θ:0.15o
Vision System Carried camera 0.3M pixels, accuracy: ± 0.02 mm
Fixed camera 1.3M pixels, accuracy: ± 0.01 mm
Processing speed 0.03 s / device
Programmer All-200G x 4 units, up to 32 sockets
All-300G x 4 units, up to 64 sockets
I/O Devices Tray AutoTray (up to 25 JEDEC trays)
Semi-AutoTray
Manual tray
Tape Electric tape-in, 8~32mm (2 tape-in can be installed)
Tape-out, 8~44mm, heat-sealing or adhesive cover tape, Ink marking (dot, alphanumeric character)
Tube Auto Tube-In, up to 25 tubes
Tube-In, (4 / 6 / 8 tubes)
Tube-Out (4 / 6 / 8 tubes)
Other NG box
Bowl feeder
Control system Operating system Windows 7
Control interface Monitor / Keyboard / Mouse
Comm. interface Ethernet / USB 3.0
Power AC power 220 ~ 240V single phase / 50 - 60 Hz / 2.5 kW (max capacity)
Air pressure 0.6 MPa, 45 L/min
Weight 840 kg (Main unit)

Dimension

  W D H
Main unit 1500 mm 840 mm 1510 mm(1678mm with tower light)
+ AutoTray (front) 1500 mm 1475 mm 1678 mm
+ AutoTray (back) 1500 mm 1432 mm 1678 mm
+ TapeIn / Tapeout (front) 1500 mm 1845 mm 1678 mm
+ TubeIn / TubeOut (front) 1500 mm 1650 mm 1678 mm
+ TapeIn / Tapeout (front)
+ AutoTray (back)
1500 mm 2437 mm 1678 mm

 

1Depends on IC programming time

Download AT3-310A2

Device Programmers

Automated Programming Systems

Service Change

Dear Customers

To best-support our customers, we have moved our software download service on this web to a place where registered customer can only reach.  From now on, customers need to register first in order to download up-to-date software for our products.

Please visit our "Home" page and register.  We are sorry for any inconvenience that may cause.  If you need any further assistance, please contact us for further help at sales@ms1.hilosystems.com.tw. Thank you!!

Pan Asia Programming Service with ISO-14001, ISO-9001
, and Automotive TS16949 certified.


3D Lead scan, Coplanarity, 2D measurement,
PVI defect, Scratches, Cracks etc. and Laser marking.


High density NAND,eMMC etc., Customized programming
prodution.

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