IC Programming

• Support programming for various device types, including MPU/MCU, EPROM, EEPROM, Serial EEPROM, Flash Memory, PLD/CPLD etc.
  
  
• Support programming for various device packages, including DIP, SDIP, SOP, MSOP, QSOP, SSOP, TSOP, TSSOP, PLCC, QFP, CASON, QFN, MLP, MLF, BGA, CSP, SOT, DFN etc.
  
  
• IC Manufactures：Covering major world-class brands from U.S., Japan, Taiwan, Euro etc. countries. (Please refer to weekly revised HI-LO web-site.)
  
  
• Programming Systems：Over 60 sets of AT3-300 Series Automated Equipments available to offer > 500K daily capacity of Tray / Tube / Tape IC programming and Testing.Severe process & operation control to ensure service quality and yield.
  
  

IC Marking

• Support alphanumerical marking for up to 4 letters according to customer request.
  
  
• Over 30 sets of Laser/Auto Markers available to offer > 1000K daily marking capacity. Various marking colors available according to customer request.
  
  

Taping & Reeling

• Offer inventory of various carrier and cover tapes for wide variety of packages. Perform visual inspection before taping & reeling. Customized carrier tapes can be obtained to meet specific requirements.
  
  

SD Optical Lead Inspection

• SOP Package
• TSOP Package
• BGA Package
• QFN & QFP Package

Baking & Dry Packing

• Baking for data retention test is available according to customer request. Offer pre-baking option before dry packing according to customer request. Dry packing service available for Tray devices and Tape & Reel packages.
  
  

Project

• Develop dedicated programming/testing methodology for customized products and packages. Offer total solution for mass production of device programming.
  
  

Assumptions of service capacity

• Average time：3.0 sec/unit
• Operation efficiency：85%
• Working hrs：12 working hours per day