IC test operation flow is as follows. A dedicated operation flow can be developed per product special feature or customer’s special request if agreed by both party.
*Test product, test requirement and test volume
*Test service coverage, turnkey or equipment rental
*Capability to support test item / test condition required
*Capability to support test volume / test timing required
*Capability to provide test equipment / facility required
*Customer acceptance
*Customer provide IC samples, test spec / test condition
*Customer provide vector / pattern files and test binning
*Engineer to develop / debug test program
*Provide test samples for customer verification
*Small volume / limited volume trial run
*Input order/lot test related information to ERP system
*Prepare Lot Run Card for production control
*Schedule load priority per customer requirement
*Prepare test equipment / man power needed
*Check IC type and quantity
*Do IC visual inspection
*Setup test program / condition per Run Card specified
*Final test and bin units per Run Card specified
*Sample units by running QC test program
*If fail QC sampling, analysis and retest / rework
*Screen out lead, mark, scratch and orientation failures
*Bend lead repair
*IC visual inspection sampling per MIL-STD-105E
*Sampling plan can be tightened per customer request
*Bake temperature / time per customer requirement
*Tray in / Tray out
*Packing material / packing method per customer request
*Packing labeling per customer request
*Check outgoing product, quantity, box labeling are the
same as specified on Run Card and shipping notice
*Ship right product, right quantity to right customer and
right place as per shipping notice specified