AT3-300D

Auto Programming System

Up to 2500 UPH with 4 pick & place nozzles¹
Equipped with 4 units of ALL-200G or ALL-300G programmers, supports up to 64 sockets
Flexible I/O options. Supports tray / tape / tube
Accuracy – oriented design and precise vision positioning system capable of handling 1.5mm x 1.5mm devices such as WLCSP

High throughput, high performance

Equipped with 4 nozzles, up to 2500 UPH
Well balanced hardware design with optimized system parameters ensure the handling accuracy under high speed movement

New generation device programmer

Equipped with 4 units of ALL-200G or ALL-300G programmers
Up to 64 devices programming simultaneously
Support wide range of devices including MCU/MPU, EEPROM, eMMC, eMCP, SPI memory, NOR/NAND flash, FPGA, etc…

Precise vision positioning system

Carried camera (0.3M pixels) for socket positioning
Fixed camera (1.3M pixels) for IC pick & place positioning
Minimize the jam rate during handling as well as the possibility of lead bent. Capable of handling as small as 1.5mm x 1.5mm devices such as WLCSP
New generation image processing core realizes fully auto vision positioning process

Smart operating software

All setup data such as IC type, socket type and position, are saved accordingly to achieve zero changeover time
User friendly operating interface minimize the possibility of misoperation
Provides detailed information of machine status, production status, warning, etc…
Detailed production reports and log files are saved for traceability

Support package conversion between tray / tube / tape

Other optional equippments


Laser marker	Label feeder	Pad printing system

Specifications

Throughput		Max. 2500 UPH
Pick & Place System	Transmission	Precision ball screws and linear guides
	Drive system	Servo motors
	Resolution	X/Y/Z:0.0025 mm；θ:0.15^o
Vision System	Carried camera	0.3M pixels, accuracy: ± 0.02 mm
	Fixed camera	1.3M pixels, accuracy: ± 0.01 mm
	Processing speed	0.03 s / device
Programmer		All-200G x 4 units, up to 32 sockets
Programmer		All-300G x 4 units, up to 64 sockets
I/O Devices	Tray	AutoTray (up to 25 JEDEC trays)
		Semi-AutoTray
		Manual tray
	Tape	Electric tape-in, 8~32mm (2 tape-in can be installed)
	Tape	Tape-out, 8~44mm, heat-sealing or adhesive cover tape, Ink marking (dot, alphanumeric character)
	Tube	Auto Tube-In, up to 25 tubes
		Tube-In, (4 / 6 / 8 tubes)
		Tube-Out (4 / 6 / 8 tubes)
	Other	NG box
	Other	Bowl feeder
Control system	Operating system	Windows 7
	Control interface	Monitor / Keyboard / Mouse
	Comm. interface	Ethernet / USB 3.0
Power	AC power	220 ~ 240V single phase / 50 - 60 Hz / 2.5 kW (max capacity)
Air pressure		0.6 MPa, 45 L/min
Weight		840 kg (Main unit)

Dimension

	W	D	H
Main unit	1500 mm	840 mm	1510 mm(1678mm with tower light)
+ AutoTray (front)	1500 mm	1475 mm	1678 mm
+ AutoTray (back)	1500 mm	1432 mm	1678 mm
+ TapeIn / Tapeout (front)	1500 mm	1845 mm	1678 mm
+ TubeIn / TubeOut (front)	1500 mm	1650 mm	1678 mm
+ TapeIn / Tapeout (front) + AutoTray (back)	1500 mm	2437 mm	1678 mm

¹Depends on IC programming time

Automated Tray IC Marking System

Introduction

HL-650 is a tray automatic marking system. It is easy to operate with a simple control panel. It only takes 1 ½ minutes to mark one tray of ICs. It is a high quality, high efficiency, automatic marking system. HL-650 is also very compact so it does not take much space.

Key Feature

Automatic operation
Tray automatically moves in and out to change the tray.

Easy to operate with a user friendly graphical interface.
The software operation is very simple and the settings can be saved for repeated use.
Several software functions help to prevent human error.

High-speed marking
Throughput: 3,500 IC units per hour. One tray: 1 ½ minutes

No risk of damaging the IC caused by handling the IC
Without the manual IC picking, placing and touching, the automatic tray-in/ tray-out can greatly reduce the risk of damaging the IC.

Specification

Input /Output
- Built-in Automatic tray in / tray out (automatically changes tray)
- Maximum 25 trays
Marking style
- Automatic marking
- Marks dots (1.5mm~2.0mm) / letters / numbers (2mm~3mm)
Throughput
- ~3,500 UPH (including tray changing time)
- ~4,000 UPH (without tray changing)
Voltage / Air Pressure
- Power: AC 190V-240V / 50-60 Hz Single Phase
- Air Pressure 0.6MPa
Dimension
- W x D X H: 660 mm x 430 mm x 1200 mm
Controller
- Main controller: Single chip

Automated Tray IC Lead /

Mark Inspection System

Introduction

HL-760S system performs efficient and precise lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. The lead scanning mechanism performs multi-unit pick & place lead / ball scanning while the mark scanning and sorting mechanism performs column-by-column mark / surface scanning as well as sorting and binning of pass and fail units.

This multi-task design makes system throughput up to around 12K UPH for operation depending on IC package size. Besides, system designed with small size, low height and storage space on the top can optimize spatial allocation for operation.

Key Features

System performs inspection for ICs on tray. Tray device loads tray to perform lead / ball and mark / surface scanning and record pass and fail units in system.

Failures are then sorted to failure trays while the vacancies are fed with spare passes and then moved to Tray Out stack.

System function

Lead / Ball inspection
System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew, terminal dimension, standoff …etc. for TSOP, QFP… packages. System also provides 3D measurements of ball pitch, ball diameter, ball co-planarity, ball offset, ball height, ball shape, ball quality…etc. for BGA package.
Mark / Surface inspection
Either single marking criteria can be set for all characters or 3 different criteria can be individually set for small, medium and large characters to screen out defects of double marking, low contrast marking, voids or bleeds in the mark, broken or smeared characters...etc. System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc.
3D optical measurement
The 3DX, accommodated with 2 high resolution digital cameras plus working with powerful I-Cite vision software, provides the algorithms for high speed, accurate 3D image acquiring and measurement. Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel.
High throughput
Parallel scanning and sorting, visual scanning on the fly without having to stop and position as well as extremely high speed image processing contribute system throughput up to 12K UPH depending on IC package size.
Statistical report
System provides data collection report including yield summary, rejects summary and overall statistical summary with detailed CPK data for Process and QA engineering.

Specification

Motion
X-Y drive︰High performance servo drive system
Transmission︰Ball screw & linear guide mechanism
Resolution︰
X axis︰±0.03mm
Y axis︰±0.04mm
Z axis︰±0.04mm
Max. stroke︰
Lead scanning︰ X axis︰645mm, Z axis︰16mm
Sorting︰X axis︰840mm, Z axis︰16mm
Auto Tray︰ Y axis︰1140mm
Semi-auto Tray︰ Y axis︰475mm
Pick & Place︰
Lead scanning︰12 nozzles with 8.8mm ~ 16mm variable pitch
Sorting︰1 nozzle

Vision
Camera︰
Fixed 3D cameras 1024 x 768 pixels for lead / ball inspection
Carried 2D camera 1024 x 768 pixels for mark / surface inspection
Field of view︰Optional 25mm x 25mm / 50mm x 50mm
Image acquiring time︰~ 50 ms / image
Image processing time︰30 ~ 60 ms / image
Optical process speed︰~ 60K UPH (without handler index time)
Repeated measurement accuracy：5μm ~ 8μm

High throughput
Tray to Tray：5K~12K UPH

Applicable products
TSOP, QFP, BGA, QFN… etc. IC units packed in tray form

Control
Built-in controller︰
Vision︰PC based control with I-Cite Vision software
Mechanism︰PC based control with Visual C# software
Display / Data entry︰19” LCD monitor / Keyboard / Mouse

I/O devices
One Auto Tray device for fresh and pass units. Stack up to 20~25 trays each Auto Tray
One Semi-auto Tray device for failures

I/O Port
Ethernet / USB3.0

Air
0.6MPa( ~ 6.0kg/cm² )

Power
AC 200V ~ 245V / 50Hz ~ 60Hz Single Phase

Dimension(Base Unit)
W x D x H︰1450mm x 1100mm x 1200mm
Base weight：~750kg

Automated Tray IC Laser Marking System

Introduction

HL-740A equipment is a professional laser marker for ICs on / in tray. Automated operation with simple setting, user can adjust power and scan speed to optimize the marking result. System provides High-accuracy mode and High-speed mode.

In High-accuracy mode, system is with 0.1mm high-accuracy CCD alignment; In High-speed mode, system takes 40 seconds for one tray marking. HL-740A creates high-quality and high-efficiency IC mass marking

Key Features

Automated operation
Auto tray move in, move out and replacement. Without IC picking & placing and touching can reduce the risk of damaging IC.
Powerful operation software
Set parameters are saved for same marking operation. Graphical user interface makes it easy to access.
High-accuracy marking
With 0.1mm high-accuracy CCD alignment marking, system creates high quality marking on a wide range of materials by different kinds of power and scan speed.
High-speed marking
After CCD aligning per tray at a time, system marks whole IC on tray. Besides, system takes about 40 seconds per tray to finish character marking.

Specification

Motion
Tray X-Y driver axis servo drive
CCD single-axis servo drive

Marking style
XYZ 3-Axis simultaneous scanning method, YVO₄(1064nm)

Marking accuracy
0.1mm

Minimum character size (height / width)
0.1mm x 0.1mm

Optical module
27um/pixel, provide marking position alignment

Applicable products
TSSOP, TSOP, SOP, TQFP, QFP, BGA

Throughput (for SOP8)
High-accuracy mode : 4600 ~ 4800 UPH
High-speed mode : 14000 ~ 14200 UPH

I/O devices
Built-in Auto Tray I/O
Stack up to 20~25 JEDEC / EIAJ tray

Controller
PC-based control with Windows 7

Display / Data Entry
LCD monitor, keyboard, mouse

Dimension
W x D x H : 1390mm x 1000mm x 1930mm
(H: 1930mm with tower light installed)

Weight
~ 655 kg

Optional
Dust collector

IC Taping Optical Inspection System

Introduction

HL-730A IC Taping Optical Inspection System is an auto visual inspection equipment for IC taping processing. System offers excellent performance through graphical user interface, providing fast and stable visual inspection of pocketed IC orientation, dot, marking, PVI, bent lead, void, stacking (optional) , flip-over as well as tape sealing. HL-730A is the best vehicle to ensure quality of IC taping operation.

Key Features

Fast and stable inspection capability
Using our superior image processing library, HL-730A system optimizes each inspection function and significantly shorten processing time to provide fast and stable inspection capability.
High production throughput
UPH (Unit Per Hour) reaches up to 40K. IC tape with pocket pitch less than 8mm can have 40000 units / hour inspection throughput.
Powerful operation software
Easy-to-use graphical user interface Parameter setup can be saved for next time operation without re-learning of sample image.
Inspection results is available for engineering analysis, yield improvement and quality traceability.
Intelligent operation
Flexible inspection operation. Two operation modes are available：
1.Fail-Mark Mode (optional)：Record the abnormality index and re-inspect while
tape reversing. If it fails again, mark it on tape.
2.Fail-Pause Mode：(Normal Mode). Record the abnormality index and reinspect
while tape reversing. If it fails again, then pause on fail for disposition.
Wide range of tape width
Applicable for tape with tape width from 8mm to 44mm
(Optical Module needs to be replaced for tape width > 25mm)

Specification

Visual system
Image resolution：1296 x 966 pixels

Throughput
40000UPH (IC tape with pocket pitch < 8mm)

IC inspection items
Pocket IC Orientation
Pocket IC Dot
Missing Dot / Dot Size / Broken Dot
Pocket IC Void
Pocket IC Stacking (optional)
Tape Sealing
Miss Alignment / Broken Sealing
Pocket IC Bent Lead
Pocket IC Marking
Pocket IC PVI

I/O
Reel Input / Reel Output

Control
PC-based control with Windows XP

Power & Air
Power：AC 200 ~ 245V / 50-60Hz Single Phase
Air pressure：0.6MPa( ~ 6.0kg/cm² )

Dimension
W x D x H︰1,117mm x 390mm x 1,575mm

High throughput, high performance

New generation device programmer

Precise vision positioning system

Smart operating software

Support package conversion between tray / tube / tape

Other optional equippments

Specifications

Dimension

Introduction

Key Feature

Specification

Introduction

Key Features

Specification

Introduction

Key Features

Specification

Introduction

Key Features

Specification

Device Programmers

Automated Programming Systems

Download AT3-300D

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AT3-300D

High throughput, high performance

New generation device programmer

Precise vision positioning system

Smart operating software

Support package conversion between tray / tube / tape

Other optional equippments

Specifications

Dimension

Introduction

Introduction

Introduction

Introduction

Device Programmers

Automated Programming Systems

Download AT3-300D