Automated Systems
| Flash Memory Testers | |
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ICT-96(B) | ICT-192 (8/16 sockets, for NOR/NAND/Flash memory |
Flash Memory Automated Testing Systems | |||
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| HL-300i | HL-600i | HL-900i | HL-1200i |
| (48/96 sockets, for Tube In/Out) | (48/96 sockets, for Tray) | (48/96 sockets, for Bowl Feeder) | (120/240 sockets, for Tray) |
| IC Vision Inspection Systems | ||
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| HL-730A | HL-760S | HL-740A |
| (For reel only, 2D-lead Scan System) | (For tray only, 3D-lead Scan Mark Inspection System) | (For trayonly, Optical Alignment, Laser Marking System) |
IC Bonding Vision Inspection/Measurement Systems | |||
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| HL-620 | HL-660 | HL-640 | |
| (Wire-bond Measurement System ) | (Die-Bond Measurement System) | (High Speed Wire-Bond Inspection System) | |
Memory IC Automated Testing System |  |
Specification
| Pick-and-Place | Precision | ±0.02mm |
| Pick heads | suction cup * 4 | |
| Performance | 1500 UPH | |
| Control | X-Y-Z 3-axis | servo motor |
| Movement | Ball screw and Linear Guideway | |
| Resolution | X/Y axis：0.0025mm；Z axis：0.01mm | |
| Maximal Travel Distance | X axis:947mm、Y axis:1052.5mm、Zaxis :25mm | |
| θ axis resolution | 0.15° | |
| Input/Output | Tray input and output | 1.Auto-stacker * 2；each one takes 25 trays |
| 2.半自动出料盘*3 | ||
| Visual system | Cameras | 1. Table CCD: 130 million pixels (fixed) |
| 2. Arm CCD: 130 million pixels (travelling) | ||
| Image precision | ±0.01mm | |
| Image processing speed | ~ 0.03 sec / unit | |
| Tester System | Tester | ICT-192 x 12 |
| Dut(Device Under Test) | 12*16 | |
| Operation Conditions | Input Voltage | 220 ~ 240 VAC single phase, 50 ~ 60 Hz |
| Consumption | 20 KVA | |
| Air supply | 45 liter/min | |
| Air compressor | 0.6 MPa (~6.0 kg/cm2) | |
Working temperature/Humidity | Temperature：23°C±5°C | |
| Humidity：50%±20% | ||
| Dimension | Main body | W x D x H: 1680mm x 1540mm x 1460mm ; w/monitor H: 1820mm |
| Main body + Auto-stackers | W x D x H: 1680mm x 2070mm x 1460mm ; w/monitor H: 1755mm | |
| Weight | 1000 KG |
Memory Automated Testing System Built-in 4 sets of ICT-384 tester，provides maximally 32 x 4 128 duts parallel testing. Proprietary for high density NOR/NAND Flash or serial Flash memory that requires long elapsed testing time. |  |
Features
■ One-Stop-Take-All
Fully automatic control on load/pick-and-place/test/bin/unload in sequence.
■ Pick and Place
Two high resolution CCD cameras in place for precise alignment. Fixed (on table) upward CCD for IC device alignment and Carried (by arm) downward CCD for socket alignment.
■ Multiple ICs Parallel Test
4 sets of ICT-384 tester provide maximally 128 duts parallel test
■ High Throughput
picks up 4 chips at a time and place one-by-one in sequence, performs about 1,200 uph capacity(if testing time < 6 minutes)
■ Intuitive User Interface
User friendly Intuitive graphic user interface software.
The settings of parameters and test result are autosaved for next job, qualilty control and yield-rate tracking.
Please contact Hi-Lo sales representitives for details. You may click the button below for contact information. Thank you!