Introduction
AT3-300D equipment is an economical multiple pick & place auto programmer for ICs on / in tray, tube and tape. System is equipped with 2 pick & place nozzles and 2 built-in Programming Units. It provides intelligent operation for IC programming, tape-out-marking and packing conversion with powerful software control.
The resident Programming Units offer efficient and reliable multi-site IC programming. Optional tape-out-marking is available after programming. A variety of I/O devices can be mounted and changed easily providing flexibility of input / output options basing on IC packing form.
AT3-300D System takes about 5.5 sec. for each 2 units of pick & place thus get throughput up to ~1300 UPH for ICs with programming time less than 22 sec.
Key Features
- Excellent performance
The system can operate a variety of input and output options with tray, tube and tape I/O devices thus provides programming, tape-out-marking and packing conversion for most of IC products on / in tray, tube and tape. - Intelligent operation
Automatic multiple pick & place operation in sequence of IC loading / pickup / positioning / insertion / programming / sorting / optional marking / unloading with powerful software control. - Accurate positioning
System is equipped with two precise CCD. One fixed, upward CCD for IC positioning while the other carried, downward CCD for sockets / pick & place spots positioning. - Reliable programming
The built-in programmers are designed with high speed CPU, resided FPGA, high capacity pin drivers and USB interface, thus providing a high speed, low noise, accurate and reliable programming platform. - Multi-site programming
Programming Module may have 1, 2, 4, 6 or 8 sockets on board considering programming time. Up to 8 x 2 = 16 units of IC can be programmed simultaneously, thus eliminating / minimizing handler idle time when programming high capacity memory devices. - High throughput
Up to ~1300 UPH, about 5.5 sec. handler index time for each 2 units of pick & place. System offers ~1300 units / hour consistent throughput for ICs with programming time less than 22 sec. - Optional marking
System provides optional dot / alphanumeric tape-out-marking after programming. - Easy change-over & maintenance
Easy and fast change-over of socket modules and I/O devices when switching IC products among tray, tube and tape. Power-on self-diagnostics and modularized design allow system easy for maintenance, repair and replacement. - Powerful operation software
Both setup data and results are automatically saved for next power-on operation as well as for quality / yield traceability. Graphical user interface makes it easy to access.
Specification
- Motion
X-Y drive：High performance servo drive system
Transmission : Ball screw & linear guide mechanism
Resolution : X axis: ±0.03mm, Y axis: ±0.02mm, Z axis: ±0.02mm
Max. stroke : X axis: 472mm, Y axis: 645mm, Z axis: 50 mm
Theta axis resolution : 0.15°
Pick & Place head placement accuracy : ±0.10mm - Vision
Camera：
Fixed CCD: 659 x 494 pixels.
Carried CCD: 659 x 494 pixels
Field of view：19.2mm x 19.2mm
Vision alignment：IC corner leads
Vision accuracy：±0.01mm
Vision process time：~ 0.1 sec / unit - Programming
Resident programmer：
ALL-100A for programming of regular MCU and memory devices
FLASH-100 for programming of high capacity memory devices
Programming site：8 x 2 = 16 sites
Pin driver：
ALL-100A: 68 universal pin drivers per set
FLASH-100: 56 x 8 universal pin drivers per set
Applicable products：PROM, EPROM, EEPROM, FLASH, MCU, PLD, PAL, FPGA... etc.
Applicable packages：SOP, SSOP, PLCC, MLF, TSOP, QFP, QFN, TQFP, BGA, μBGA…etc. - Marking
Optional tape-out-marking with dot (1.5mm ~ 2.0mm) or alphanumeric (2mm x 3mm) - Throughput
Handler index time：~ 5.5 sec. / 2 units
Throughput：~ 1300 UPH - I/O devices
Auto Tray :
Auto tray move in, move out and replacement.
Stack up to 20~25 JEDEC trays for fresh / pass units
Semi-auto Tray : Auto tray move in, move out but manual replacement for fresh / pass units
Manual Tray : Two JEDEC trays for manual input / output or spares / rejects binning
NG Plate : One small plate for prog. & other rejects
Tube Input :
150mil, 208mil, 300mil… packages available.
Load capacity : 4 tubes
Tube Output :
150mil, 208mil, 300mil… packages available.
Load capacity : 4 or 6 tubes
Tape Input：
Options of mechanical drive mode & electrical drive mode are available
Tape In with 12 ~ 32mm tape width is available
Up to 2 sets of Tape In can be installed in parallel for tape width 12 ~ 16mm
Tape Output ：
Options of heat sealing mode & pressure sealing mode are available
Accept tape with 12 ~ 32mm tape width - Control
Built-in Controller：PC-based control with Windows XP
Display : 19” LCD monitor
Data entry : Keyboard / mouse - Power
AC voltage：200 ~ 245V / 50-60Hz Single phase.
Power consumption：1.3 KVA - Air
Air pressure：0.6 MPa (~6.0 kg/cm2)
Air consumption：25 liter/min. - Dimension
Base Unit：W x D x H : 1005mm x 1070mm x 1600mm
Base + Tray I/O：W x D x H : 1005mm x 1610mm x 1600mm
Base + Tube I/O：W x D x H : 1005mm x 1780mm x 1600mm
Base + Tape I/O：W x D x H : 1005mm x 2045mm x 1600mm - Weight
Base Unit : ~ 470 kg
