Wire Bond Measurement System |
Specification
Dimension | 1120*1220*1700mm |
Weight | 1460 kg |
Power requirement | 220VAC, 60Hz |
10A | |
1KW | |
Air consumption | 0.6 MPa, 55 l/min |
Substrate/Lead frame size | W: 25 ~ 80 mm |
L: 140 ~ 300 mm | |
Working platform/Carrier | X/Y table working range: 400*140mm |
X/Y table resolution: +/- 0.1 um | |
Z axis resolution: +/- 0.01 um | |
Support lead frame/substrate | |
Measure | 5M Camera, sensor size 1 |
5X resolution: 1 um/pixel | |
50X resolution: 0.1 um/pixel | |
100X resolution: 0.05 um/pixel | |
Ball(X/Y)/Stitch(X/Y) Measurement: 10~60 um | |
Ball(Z) Measurement range: 1~800 um | |
Loop Height/Die Gap/Lop Gap/Kink Height/The highest Loop Measurement range: 1um ~ 5000um | |
The heightest loop search area:2500x2000um | |
Measure cycle time | Cu(1 wire/ball, fixed loop, stitch):35 sec. |
Cu(1 wire/ball, serach loop, stitch):95 sec. | |
Au(1 wire/ball, fixed loop, stitch):40 sec. | |
Au(1 wire/ball, search loop, stitch):100 sec. | |
Report format | TXT/XML/CSV |
Communication interface | SECS/GEM(Optional) |
User interface | Monitor, keyboard, barcode reader |