Wire Bond Measurement System |
|
Specification
| Dimension | 1120*1220*1700mm |
| Weight | 1460 kg |
| Power requirement | 220VAC, 60Hz |
| 10A | |
| 1KW | |
| Air consumption | 0.6 MPa, 55 l/min |
| Substrate/Lead frame size | W: 25 ~ 80 mm |
| L: 140 ~ 300 mm | |
| Working platform/Carrier | X/Y table working range: 400*140mm |
| X/Y table resolution: +/- 0.1 um | |
| Z axis resolution: +/- 0.01 um | |
| Support lead frame/substrate | |
| Measure | 5M Camera, sensor size 1 |
| 5X resolution: 1 um/pixel | |
| 50X resolution: 0.1 um/pixel | |
| 100X resolution: 0.05 um/pixel | |
| Ball(X/Y)/Stitch(X/Y) Measurement: 10~60 um | |
| Ball(Z) Measurement range: 1~800 um | |
| Loop Height/Die Gap/Lop Gap/Kink Height/The highest Loop Measurement range: 1um ~ 5000um | |
| The heightest loop search area:2500x2000um | |
| Measure cycle time | Cu(1 wire/ball, fixed loop, stitch):35 sec. |
| Cu(1 wire/ball, serach loop, stitch):95 sec. | |
| Au(1 wire/ball, fixed loop, stitch):40 sec. | |
| Au(1 wire/ball, search loop, stitch):100 sec. | |
| Report format | TXT/XML/CSV |
| Communication interface | SECS/GEM(Optional) |
| User interface | Monitor, keyboard, barcode reader |