Introduction
HL-760S system performs efficient and precise lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. The lead scanning mechanism performs multi-unit pick & place lead / ball scanning while the mark scanning and sorting mechanism performs column-by-column mark / surface scanning as well as sorting and binning of pass and fail units.
This multi-task design makes system throughput up to around 12K UPH for operation depending on IC package size. Besides, system designed with small size, low height and storage space on the top can optimize spatial allocation for operation.
Key Features
System performs inspection for ICs on tray. Tray device loads tray to perform lead / ball and mark / surface scanning and record pass and fail units in system.
Failures are then sorted to failure trays while the vacancies are fed with spare passes and then moved to Tray Out stack.
System function
- Lead / Ball inspection
System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew, terminal dimension, standoff …etc. for TSOP, QFP… packages. System also provides 3D measurements of ball pitch, ball diameter, ball co-planarity, ball offset, ball height, ball shape, ball quality…etc. for BGA package. - Mark / Surface inspection
Either single marking criteria can be set for all characters or 3 different criteria can be individually set for small, medium and large characters to screen out defects of double marking, low contrast marking, voids or bleeds in the mark, broken or smeared characters...etc. System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc. - 3D optical measurement
The 3DX, accommodated with 2 high resolution digital cameras plus working with powerful I-Cite vision software, provides the algorithms for high speed, accurate 3D image acquiring and measurement. Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel. - High throughput
Parallel scanning and sorting, visual scanning on the fly without having to stop and position as well as extremely high speed image processing contribute system throughput up to 12K UPH depending on IC package size. - Statistical report
System provides data collection report including yield summary, rejects summary and overall statistical summary with detailed CPK data for Process and QA engineering.
Specification
- Motion
- X-Y drive︰High performance servo drive system
- Transmission︰Ball screw & linear guide mechanism
- Resolution︰
- X axis︰±0.03mm
- Y axis︰±0.04mm
- Z axis︰±0.04mm
- Max. stroke︰
- Lead scanning︰ X axis︰645mm, Z axis︰16mm
- Sorting︰X axis︰840mm, Z axis︰16mm
- Auto Tray︰ Y axis︰1140mm
- Semi-auto Tray︰ Y axis︰475mm
- Pick & Place︰
- Lead scanning︰12 nozzles with 8.8mm ~ 16mm variable pitch
- Sorting︰1 nozzle
- Vision
- Camera︰
- Fixed 3D cameras 1024 x 768 pixels for lead / ball inspection
- Carried 2D camera 1024 x 768 pixels for mark / surface inspection
- Field of view︰Optional 25mm x 25mm / 50mm x 50mm
- Image acquiring time︰~ 50 ms / image
- Image processing time︰30 ~ 60 ms / image
- Optical process speed︰~ 60K UPH (without handler index time)
- Repeated measurement accuracy:5μm ~ 8μm
- High throughput
- Tray to Tray:5K~12K UPH
- Applicable products
- TSOP, QFP, BGA, QFN… etc. IC units packed in tray form
- Control
- Built-in controller︰
- Vision︰PC based control with I-Cite Vision software
- Mechanism︰PC based control with Visual C# software
- Display / Data entry︰19” LCD monitor / Keyboard / Mouse
- I/O devices
- One Auto Tray device for fresh and pass units. Stack up to 20~25 trays each Auto Tray
- One Semi-auto Tray device for failures
- I/O Port
- Ethernet / USB3.0
- Air
- 0.6MPa( ~ 6.0kg/cm2 )
- Power
- AC 200V ~ 245V / 50Hz ~ 60Hz Single Phase
- Dimension(Base Unit)
- W x D x H︰1450mm x 1100mm x 1200mm
- Base weight:~750kg