3D Lead Scan and Mark Inspection System

Key Features

System performs inspection for ICs on tray. Tray device loads tray to perform lead / ball and mark / surface scanning and record pass and fail units in system.

Failures are then sorted to failure trays while the vacancies are fed with spare passes and then moved to Tray Out stack.

System function

• Lead / Ball inspection
  System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew, terminal dimension, standoff …etc. for TSOP, QFP… packages. System also provides 3D measurements of ball pitch, ball diameter, ball co-planarity, ball offset, ball height, ball shape, ball quality…etc. for BGA package.
• Mark / Surface inspection
  Either single marking criteria can be set for all characters or 3 different criteria can be individually set for small, medium and large characters to screen out defects of double marking, low contrast marking, voids or bleeds in the mark, broken or smeared characters...etc. System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc.
• 3D optical measurement
  The 3DX, accommodated with 2 high resolution digital cameras plus working with powerful I-Cite vision software, provides the algorithms for high speed, accurate 3D image acquiring and measurement. Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel.
• High throughput
  Parallel scanning and sorting, visual scanning on the fly without having to stop and position as well as extremely high speed image processing contribute system throughput up to 12K UPH depending on IC package size.
• Statistical report
  System provides data collection report including yield summary, rejects summary and overall statistical summary with detailed CPK data for Process and QA engineering.

Specification