HL-760S system performs efficient and precise lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. The lead scanning mechanism performs multi-unit pick & place lead / ball scanning while the mark scanning and sorting mechanism performs column-by-column mark / surface scanning as well as sorting and binning of pass and fail units.

This multi-task design makes system throughput up to around 12K UPH for operation depending on IC package size. Besides, system designed with small size, low height and storage space on the top can optimize spatial allocation for operation.

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