HL-660 |
Specification
Dimension | 1120*1220*1700mm |
Weight | 1460kg |
Power requirement | 220 VAC, 60Hz |
5A | |
1.1KW | |
Air consumption | 0.6MPa, 55 l/min |
Substrate/lead frame size | W: 15~125 mm |
L: 140~300mm | |
Working platform/carrier | X/Y table working range: 500*300mm |
X/Y table resolution: ±0.1um | |
Z axis resolution: ±001um | |
Supports substrate/lead frame | |
Camera | 5M Camera, sensor size 1" |
5X resolution:1um/pixel(for Die Rotation/Epoxy Fillet Height) | |
20X resolution:0.25um/pixel(for Die Location/Die Tilt/Silver Paste Thickness) | |
100X resolution 0.05um/pixel(for Die Tilt/Silver Paste Thickness) | |
Measurement accuracy | Silver Paste Thickness: ±0.5um |
Die Tilt: ±0.5um | |
Epoxy Fillet Height: ±1um | |
Die Location: ±2um | |
Die Rotation: ±0.1o | |
Measurement range | Die Size: 25x25 ~ 800x800mils |
Die Thickness: 2 ~ 50 mils | |
Substrate/Lead Frame Size: | |
W: 25 ~ 100mm | |
L: 140 ~ 300mm | |
Measure cycle time | 1. Die Size < 2mm x 2mm ≤ 150 seconds/measurement 1 unit |
2. 2mm x 2mm < Die Size < 6mm x 6mm ≤ 210 seconds/measurement 1 unit. |