HL-660 |
|
Specification
| Dimension | 1120*1220*1700mm |
| Weight | 1460kg |
| Power requirement | 220 VAC, 60Hz |
| 5A | |
| 1.1KW | |
| Air consumption | 0.6MPa, 55 l/min |
| Substrate/lead frame size | W: 15~125 mm |
| L: 140~300mm | |
| Working platform/carrier | X/Y table working range: 500*300mm |
| X/Y table resolution: ±0.1um | |
| Z axis resolution: ±001um | |
| Supports substrate/lead frame | |
| Camera | 5M Camera, sensor size 1" |
| 5X resolution:1um/pixel(for Die Rotation/Epoxy Fillet Height) | |
| 20X resolution:0.25um/pixel(for Die Location/Die Tilt/Silver Paste Thickness) | |
| 100X resolution 0.05um/pixel(for Die Tilt/Silver Paste Thickness) | |
| Measurement accuracy | Silver Paste Thickness: ±0.5um |
| Die Tilt: ±0.5um | |
| Epoxy Fillet Height: ±1um | |
| Die Location: ±2um | |
| Die Rotation: ±0.1o | |
| Measurement range | Die Size: 25x25 ~ 800x800mils |
| Die Thickness: 2 ~ 50 mils | |
| Substrate/Lead Frame Size: | |
| W: 25 ~ 100mm | |
| L: 140 ~ 300mm | |
| Measure cycle time | 1. Die Size < 2mm x 2mm ≤ 150 seconds/measurement 1 unit |
| 2. 2mm x 2mm < Die Size < 6mm x 6mm ≤ 210 seconds/measurement 1 unit. |