Besides specializing in design, manufacturing and marketing of device programmers, HI-LO SYSTEMS established its first ProgrammingCenter, located at Neihu Taipei(headqarter), in 2001 to extend its expertise into the field of IC programming services to satisfy the high demands coming from IT and the hand-held device market.
With powerful support from the HI-LO engineering team and over 200 sets of automated programming systems installed, HI-LO Programming Centers are able to offer comprehensive and also competitive solutions for device programming, ink / laser marking, taping & reeling, 3D optical lead inspection, baking and dry packing, etc., including special requests of customized device programming and packing.
Hi-Lo ShenZhen Programming Center was established in 2010, all programming processes and operations are under the strictest control. Optimum programming quality, yield and efficiency are sustained at the highest levels. The ProgrammingCenter is capable of offering programming services for over 200K units daily. Since we developed the necessary technology ourselves and work with key IC manufacturers at very early stages, HI-LO has already become the most important programming service provider in the market.
Facilities and Capacity
Automated Systems:
AT3-3xx with 4-socket modules & Tape I/O x 30 sets
Tape IC inspection system x 2 sets (checking empty pockets, seals, orientation etc.)
Working Model
12 hours per day, 7 days per week with 2 working shifts rotated.
Max. Capacity
5 millions/month
Services
IC Programming ·Support programming for various device types, including MPU/MCU, EPROM, EEPROM, Serial EEPROM, Flash Memory, PLD/CPLD etc. ·Support programming for various device packages, including DIP, SDIP, SOP, MSOP, QSOP, SSOP, TSOP, TSSOP, PLCC, QFP, CASON, QFN, MLP, MLF, BGA, CSP, SOT, DFN etc. ·IC Manufactures:Covering major world-class brands from the U.S., Japan, Taiwan, European countries, etc. ·Programming Systems:Over 30 sets of AT3-300 Series Automated Equipments available to offer > 200K daily capacity of Tray / Tube / Tape IC programming. Strict process & operation control to ensure service quality and yield.
Ink Marking ·Support alphanumerical marking for up to 4 letters according to customer request.
Taping & Reeling ·Offer inventory of various carrier and cover tapes for a wide variety of packages. Perform visual inspection before taping & reeling. Customized carrier tapes can be obtained to meet specific requirements.
3D Optical Lead Inspection ·SOP Package ·TSOP Package ·BGA Package ·QFN & QFP Package
Baking & Dry Packing ·Baking for data retention test is available according to customer request. Offer pre-baking option before dry packing according to customer request. Dry packing service available for Tray devices and Tape & Reel packages.
Project ·Develop dedicated programming methodology for customized products and packages. Offer total solution for mass production of device programming.
Standard IC device programming.
Tape and Reeling.
Baking
Serialization
Sequential Serial Data programming
Random Serial Data(Data merge)
First article
Hardware/Software version control.
Proprietary Programming Hardware and Software
WLCSP, proprietary form factor customization
Trace data logging(collect via LAN)
Customized Production Process
Thin fine pitch package
Customer's source code security assurance
Data encryption/decryption(RSA-2048)
Map
Hi-Lo System
Hi-Lo System ShenZhen Co. Ltd
Zone A, 2F, Building H, Gang Zhi Long Technology Park, Qinglong Rd., Longhua New Dist., Shenzhen City, Guangdong Province, China.